The following is a list of Intel Core mobile processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture; as well as its Core 2– (Solo/Duo/Quad/Extreme), Core i3–, Core i5–, Core i7–, Core i9–, Core M– (m3/m5/m7), Core 3–, Core 5–, Core 7–, and Core 9–branded processors.

Release timeline

Mobile processors

2009	Nehalem microarchitecture (1st generation)
2010	Westmere microarchitecture (1st generation)
2011	Sandy Bridge microarchitecture (2nd generation)
2012	Ivy Bridge microarchitecture (3rd generation)
2013	Haswell microarchitecture (4th generation)
2014
2015	Broadwell microarchitecture (5th generation)
	Skylake microarchitecture (6th generation)
2016
2017	Kaby Lake microarchitecture (7th/8th generation)
2018	Coffee Lake microarchitecture (8th generation)
2019	Comet Lake microarchitecture (10th generation)
	Ice Lake (10th generation)
2020	Tiger Lake (11th generation)
2021
2022	Alder Lake (12th generation)
2023	Raptor Lake (13th generation)
	Raptor Lake (14th generation)
	Meteor Lake (Ultra Series 1)
2024	Lunar Lake (Ultra Series 2)
	Raptor Lake (Ultra Series 2)
2025	Arrow Lake (Ultra Series 2)
2026	Panther Lake (Ultra Series 3)

Model	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Release price (USD)
Core Solo U1300	1.07 GHz	2 MB	533 MT/s	8×	0.95–1.05 V	5.5 W	Socket 479/FC-μBGA	April 2006	$241
Core Solo U1400	1.2 GHz	2 MB	533 MT/s	9×	0.95–1.05 V	5.5 W	Socket 479/FC-μBGA	April 2006	$262
Core Solo U1500	1.33 GHz	2 MB	533 MT/s	10×	0.85–1.1 V	5.5 W	Socket 479/FC-μBGA	January 2007	$262
Core Duo U2400	1.07 GHz	2 MB	533 MT/s	8×	0.8–1.1 V	9 W	Socket 479/FC-μBGA	June 2006	$262
Core Duo U2500	1.2 GHz	2 MB	533 MT/s	9×	0.8–1.1 V	9 W	Socket 479/FC-μBGA	June 2006	$289
Core Duo L2300	1.5 GHz	2 MB	667 MT/s	9×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	January 2006	$284
Core Duo L2400	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	January 2006	$316
Core Duo L2500	1.83 GHz	2 MB	667 MT/s	11×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	September 2006	$316
Core Solo T1200	1.5 GHz	2 MB	667 MT/s	9×	0.7625–1.3 V	27 W	Socket M	July 2006
Core Solo T1250	1.73 GHz	2 MB	533 MT/s	13×	0.7625–1.3 V	31 W	Socket M
Core Solo T1300	1.67 GHz	2 MB	667 MT/s	10×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M	January 2006	$209
Core Solo T1350	1.87 GHz	2 MB	533 MT/s	14×	0.7625–1.3 V	31 W	Socket M	July 2006
Core Solo T1400	1.83 GHz	2 MB	667 MT/s	11×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M	May 2006	$209
Core Solo T1500	2 GHz	2 MB	667 MT/s	12×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket M	August 2006
Core Duo T2050	1.6 GHz	2 MB	533 MT/s	12×	0.762–1.3 V	31 W	Socket M	May 2006	$140
Core Duo T2250	1.73 GHz	2 MB	533 MT/s	13×	0.762–1.3 V	31 W	Socket M	May 2006	OEM
Core Duo T2300	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$241
Core Duo T2300E	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.3 V	31 W	Socket M Socket M μFCBGA-479 μFCBGA-479	May 2006	$209
Core Duo T2350	1.87 GHz	2 MB	533 MT/s	14×	0.762–1.3 V	31 W	Socket M		OEM
Core Duo T2400	1.83 GHz	2 MB	667 MT/s	11×	0.762–1.3 V	31 W 31 W 27 W 27 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$294
Core Duo T2450	2 GHz	2 MB	533 MT/s	15×	0.762–1.3 V	31 W	Socket M		OEM
Core Duo T2500	2 GHz	2 MB	667 MT/s	12×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$423
Core Duo T2600	2.17 GHz	2 MB	667 MT/s	13×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$637
Core Duo T2700	2.33 GHz	2 MB	667 MT/s	14×	0.762–1.3 V	31 W	Socket M Socket 479/FC-μBGA	June 2006	$637

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 81 mm²
• Steppings: A1

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
ultra-low voltage
Core 2 Solo ULV U2100	SLAGM (A1)	1	1.07 GHz	1 MB	533 MT/s	8×	0.86–0.975 V	5.5 W	Micro-FCBGA	September 2007	LE80537UE0041M	$241
Core 2 Solo ULV U2200	SLAGL (A1)	1	1.2 GHz	1 MB	533 MT/s	9×	0.86–0.975 V	5.5 W	Micro-FCBGA	September 2007	LE80537UE0091M	$262

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
• Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
• Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
• Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
• Die size: 143 mm² (Merom), 111 mm² (Merom-2M)
• Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
• All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo T5200	SL9VP (B2)	2	1.6 GHz	2 MB	533 MT/s	12×	0.95–1.175 V	34 W	Socket M	October 2006	LF80537GE0252M	OEM
Core 2 Duo T5250	SLA9S (M0)	2	1.5 GHz	2 MB	667 MT/s	9×	0.95–1.175 V	35 W	Socket P	Q2 2007	LF80537GF0212M	OEM
Core 2 Duo T5270	SLALK (M0)	2	1.4 GHz	2 MB	800 MT/s	7×	0.95–1.175 V	35 W	Socket P	October 2007	LF80537GG0172M	OEM
Core 2 Duo T5300	SL9WE (L2)	2	1.73 GHz	2 MB	533 MT/s	13×	0.95–1.175 V	34 W	Socket M	Q1 2007	LF80537GE0302M	OEM
Core 2 Duo T5450	SLA4F (M0)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	35 W	Socket P	Q2 2007	LF80537GF0282MT	OEM
Core 2 Duo T5470	SLAEB (M0)	2	1.6 GHz	2 MB	800 MT/s	8×	0.95–1.175 V	35 W	Socket P	July 2007	LF80537GG0252M	OEM
Core 2 Duo T5500	SL9SH (B2) SLGFK (G2) SL9U4 (L2)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	34 W	Socket M	August 28, 2006	LF80537GF0282M	$209
Core 2 Duo T5500	SL9SQ (B2) SL9U8 (L2)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	34 W	BGA479	August 2006	LE80537GF0282M	$209
Core 2 Duo T5550	SLA4E (M0)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	35 W	Socket P	January 2008	LF80537GF0342MT	OEM
Core 2 Duo T5600	SL9SG (B2) SL9U3 (L2)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0342M	$241
Core 2 Duo T5600	SL9SP (B2) SL9U7 (L2)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	34 W	BGA479	August 2006	LE80537GF0342M	$241
Core 2 Duo T5670	SLAJ5 (M0)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	Socket P	Q2 2008	LF80537GG0332MN	OEM
Core 2 Duo T5750	SLA4D (M0)	2	2 GHz	2 MB	667 MT/s	12×	0.95–1.175 V	35 W	Socket P	January 2008	LF80537GF0412M	OEM
Core 2 Duo T5800	SLB6E (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	Q4 2008	LF80537GG041F	OEM
Core 2 Duo T5850[1]	SLA4C (M0)	2	2.17 GHz	2 MB	667 MT/s	13×	0.95–1.175 V	35 W	Socket P	Q4 2008	LF80537GF0482M	OEM
Core 2 Duo T5870	SLAZR (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	2008	LF80537GG0412MN	OEM
Core 2 Duo T5900[2]	SLB6D (M0)	2	2.2 GHz	2 MB	800 MT/s	11×	0.95–1.175 V	35 W	Socket P	July 2008	LF80537GG049F	OEM
Core 2 Duo T7100	SLA4A (M0)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0332M	$209
Core 2 Duo T7100	SLA3U (M1)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0332M	$209
Core 2 Duo T7200	SL9SF (B2)	2	2 GHz	4 MB	667 MT/s	12×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0414M	$294
Core 2 Duo T7200	SL9SL (B2)	2	2 GHz	4 MB	667 MT/s	12×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0414M	$294
Core 2 Duo T7250	SLA49 (M0) SLAXH (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	September 2007	LF80537GG0412M	$290
Core 2 Duo T7250	SLA3T (M1)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	FCBGA6	September 2007	LE80537GG0412M	$290
Core 2 Duo T7300	SLAMD (G0) SLA45 (E1)	2	2 GHz	4 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0414M LF80537GG0414M	$241
Core 2 Duo T7300	SLA3P (E1) SLAMF (G0)	2	2 GHz	4 MB	800 MT/s	10×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0414M	$241
Core 2 Duo T7400	SL9SE (B2) SLGFJ (G2)	2	2.17 GHz	4 MB	667 MT/s	13×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0484M	$423
Core 2 Duo T7400	SL9SK (B2) SLGFV (G2)	2	2.17 GHz	4 MB	667 MT/s	13×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0484M	$423
Core 2 Duo T7500	SLA44 (E1) SLAF8 (G0)	2	2.2 GHz	4 MB	800 MT/s	11×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0494M	$316
Core 2 Duo T7500	SLA3N (E1) SLADM (G0)	2	2.2 GHz	4 MB	800 MT/s	11×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0494M	$316
Core 2 Duo T7600	SL9SD (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0534M	$637
Core 2 Duo T7600	SL9SJ (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0534M	$637
Core 2 Duo T7600G[3]	SL9U5 (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	Socket M	December 2006	LF80537GF0534MU
Core 2 Duo T7700	SLA43 (E1) SLAF7 (G0)	2	2.4 GHz	4 MB	800 MT/s	12×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0564M	$530
Core 2 Duo T7700	SLA3M (E1) SLADL (G0)	2	2.4 GHz	4 MB	800 MT/s	12×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0564M	$530
Core 2 Duo T7800	SLAF6 (G0)	2	2.6 GHz	4 MB	800 MT/s	13×	0.95–1.175 V	35 W	Socket P	September 2007	LF80537GG0644ML	$530
Core 2 Duo T7800	SLA75 (G0)	2	2.6 GHz	4 MB	800 MT/s	13×	0.95–1.175 V	35 W	FCBGA6	September 2007	LE80537GG0644M	$530

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
• Die size: 143 mm²
• Steppings: B2, E1, G0, G2

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SL7100[4]	SLAJD SLAT4	2	1.2 GHz	4 MB	800 MT/s	6×		12 W	μFC-BGA 956		SY80537LG0094M	OEM
Core 2 Duo L7200	SL9SN (B2)	2	1.33 GHz	4 MB	667 MT/s	8×	0.9–1.2 V	17 W	FCBGA6	Q1 2007	LE80537LF0144M	$284
Core 2 Duo L7300	SLA3S (E1)	2	1.4 GHz	4 MB	800 MT/s	7×	0.9–1.1 V	17 W	FCBGA6	May 2007	LE80537LG0174M	$284
Core 2 Duo L7400	SL9SM (B2) SLGFX (G2)	2	1.5 GHz	4 MB	667 MT/s	9×	0.9–1.2 V	17 W	FCBGA6	Q1 2007	LE80537LF0214M	$316
Core 2 Duo L7500	SLA3R (E1) SLAET (G0)	2	1.6 GHz	4 MB	800 MT/s	8×	0.9–1.1 V	17 W	FCBGA6	May 2007	LE80537LG0254M	$316
Core 2 Duo SP7500[5][failed verification][6]	SLAT2 SLAEV	2	1.6 GHz	4 MB	800 MT/s	8×	1.0–1.25 V	20 W	μFC-BGA 956		SY80537GG0254M	OEM
Core 2 Duo L7700	SLAES (G0)	2	1.8 GHz	4 MB	800 MT/s	9×	0.9–1.1 V	17 W	FCBGA6	September 2007	LE80537LG0334M	$316
Core 2 Duo SP7700[5][failed verification]	SLALQ SLALR SLASZ	2	1.8 GHz	4 MB	800 MT/s	9×	1.0–1.25 V	20 W	μFC-BGA 956		SY80537GG0334M SY80537GG0334ML	OEM

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 111 mm²
• Steppings: L2, M0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo U7500	SLA2V (L2) SLAUT (M0)	2	1.07 GHz	2 MB	533 MT/s	8×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	April 2007	LE80537UE0042M	$262
Core 2 Duo U7500	SLV3X (M0)	2	1.07 GHz	2 MB	533 MT/s	8×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	February 2008	LE80537UE0042ML	$262
Core 2 Duo U7600	SLA2U (L2) SLAUS (M0)	2	1.2 GHz	2 MB	533 MT/s	9×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	April 2007	LE80537UE0092M	$289
Core 2 Duo U7600	SLV3W (M0)	2	1.2 GHz	2 MB	533 MT/s	9×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	April 2007	LE80537UE0092ML	$289
Core 2 Duo U7700	SLA6X (L2) SLAUR (M0)	2	1.33 GHz	2 MB	533 MT/s	10×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	December 2007	LE80537UE0142M	$289
Core 2 Duo U7700	SLV3V (M0)	2	1.33 GHz	2 MB	533 MT/s	10×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	February 2008	LE80537UE0142ML	$289

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
• Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
• Die size: 143 mm²
• Steppings: E1, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme X7800	SLA6Z (E1)	2	2.6 GHz	4 MB	800 MT/s	13×	1.0375–1.3 V	44 W	Socket P	July 2007	LF80537GG0644M	$851
Core 2 Extreme X7900	SLA33 (E1) SLAF4 (G0)	2	2.8 GHz	4 MB	800 MT/s	14×	1.0375–1.3 V	44 W	Socket P	August 2007	LF80537GG0724M	$851

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
• Die size: 82 mm²
• 228 million transistors
• Package size: 22 mm × 22 mm
• Steppings: M0, R0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Small Form Factor, ultra-low voltage
Core 2 Solo SU3300	SLGAR (M0) SLGAJ (R0)	1	1.2 GHz	3 MB	800 MT/s	6×	1.05–1.15 V	5.5 W	μFC-BGA 956	May 2008	AV80585UG0093M	$262
Core 2 Solo SU3500	SLGFM (R0)	1	1.4 GHz	3 MB	800 MT/s	7×	1.05–1.15 V	5.5 W	μFC-BGA 956	Q2 2009	AV80585UG0173M	$262

• Die size: 107 mm²
• The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo E8135	SLAQA (C0)	2	2.4 GHz	6 MB	1066 MT/s	9×		44 W	Socket P	April 2008	FF80576E8135 FF80576GH0676M
Core 2 Duo E8135	SLG8W (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×		44 W	Socket P	March 2009	AW80576GH0676M AW80576E8135
Core 2 Duo E8135	SLGED (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×		35 W	Socket P	March 2009	AW80576GH0676M
Core 2 Duo E8235	SLAQB (C0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×		44 W	Socket P	April 2008	FF80576GH0726M
Core 2 Duo E8335	SLAQC (C0)	2	2.93 GHz	6 MB	1066 MT/s	11×		44 W	Socket P	April 2008	FF80576GH0776M
Core 2 Duo E8335	SLGEB (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.0500–1.2250 V	35 W	Socket P	March 2009	AW80576GH0776M
Core 2 Duo E8435	SLAQD (C0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.0500–1.2375 V	55 W	Socket P	April 2008	FF80576GH0836M
Core 2 Duo E8435	SLGEA (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×		44 W	Socket P	March 2009	AW80576GH0836M

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)^[7]
• T6570,^[8] T6670, all T8xxx and T9xxx models support Intel VT-x
• All T9xxx models support Trusted Execution Technology (TXT)
• T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

• Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
• Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)^[7]

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo T6400	SLGJ4 (R0)	2	2 GHz	2 MB	800 MT/s	10×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0412MA	OEM
Core 2 Duo T6500	SLGF4 (R0)	2	2.1 GHz	2 MB	800 MT/s	10.5×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0452ML AW80577GG0452MA	OEM
Core 2 Duo T6570	SLGLL (R0)	2	2.1 GHz	2 MB	800 MT/s	10.5×	1.00–1.250 V	35 W	Socket P	Q3 2009	AW80577GG0452MH	OEM
Core 2 Duo T6600	SLGJ9 (R0) SLGF5 (R0)	2	2.2 GHz	2 MB	800 MT/s	11×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0492MA AW80577GG0492ML	OEM
Core 2 Duo T6670	SLGLK (R0) SLGLJ (R0)	2	2.2 GHz	2 MB	800 MT/s	11×	1.00–1.250 V	35 W	Socket P	Q3 2009	AW80577GG0492MH	OEM
Core 2 Duo T6900	SLGHZ (?)	2	2.5 GHz	2 MB	800 MT/s	12.5×	1.00–1.250 V	35 W	Socket P	?	AW80577GG0602MA	OEM
Core 2 Duo T6970	SLGLJ (R0)	2	2.5 GHz	2 MB	800 MT/s	12.5×	1.00–1.250 V	35 W	Socket P	?	AW80577GG0602MH	OEM
Core 2 Duo T8100	SLAP9 (M0) SLAVJ (M0) SLAYP (M0) SLAYZ (C0) SLAUU (C0)	2	2.1 GHz	3 MB	800 MT/s	10.5×	1.000–1.250 V	35 W	Socket P	January 2008	FF80577GG0453M (M0) FF80577GG0453MN FF80576GG0453M (C0) BX80577T8100	$209
Core 2 Duo T8100	SLAPS (M0) SLAXG (M0) SLAPT (C0) SLAZD (C0)	2	2.1 GHz	3 MB	800 MT/s	10.5×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80577GG0453M (M0) EC80576GG0453M (C0)	$209
Core 2 Duo T8300	SLAPA (M0) SLAYQ (M0)	2	2.4 GHz	3 MB	800 MT/s	12×	1.00–1.250 V	35 W	Socket P	January 2008	FF80577GG0563M BX80577T8300	$241
Core 2 Duo T8300	SLAPR (M0) SLAPU (C0) SLAZC (C0)	2	2.4 GHz	3 MB	800 MT/s	12×	1.00–1.250 V	35 W	FCBGA6	January 2008	EC80577GG0563M (M0) EC80576GG0563M (C0)	$241
Core 2 Duo T9300	SLAQG (C0) SLAYY (C0)	2	2.5 GHz	6 MB	800 MT/s	12.5×	1.000–1.250 V	35 W	Socket P	January 2008	FF80576GG0606M	$316
Core 2 Duo T9300	SLAPV (C0) SLAZB (C0)	2	2.5 GHz	6 MB	800 MT/s	12.5×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80576GG0606M	$316
Core 2 Duo T9400	SLB46 (C0) SLB4D (C0) SLGE5 (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.050–1.162 V	35 W	Socket P	July 2008	AW80576GH0616M	$316
Core 2 Duo T9400	SL3BX (C0) SLGEK (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.050–1.162 V	35 W	FCBGA6	July 2008	AV80576GH0616M	$316
Core 2 Duo T9500	SLAQH (C0) SLAYX (C0)	2	2.6 GHz	6 MB	800 MT/s	13×	1.000–1.250 V	35 W	Socket P	January 2008	FF80576GG0646M	$530
Core 2 Duo T9500	SLAPW (C0) SLAZA (C0) SLB49 (C0) SLB4A (C0)	2	2.6 GHz	6 MB	800 MT/s	13×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80576GG0646M AV80576SH0616M	$530
Core 2 Duo T9550	SLGE4 (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.050–1.212 V	35 W	Socket P	December 2008	AW80576GH0676MG	$316
Core 2 Duo T9550	SLGEL (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.050–1.212 V	35 W	FCBGA6	December 2008	AV80576GH0676MG	$316
Core 2 Duo T9600	SLB47 (C0) SLG8N (C0) SLG9F (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.050–1.162 V	35 W	Socket P	July 2008	AW80576GH0726M	$530
Core 2 Duo T9600	SLB43 (C0) SLGEM (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.050–1.162 V	35 W	FCBGA6	July 2008	AV80576GH0726M	$530
Core 2 Duo T9800	SLGES (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.050–1.212 V	35 W	Socket P	December 2008	AW80576GH0776MG	$530
Core 2 Duo T9800	SLGEP (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.050–1.212 V	35 W	FCBGA6	December 2008	AV80576GH0776MG	$530
Core 2 Duo T9900	SLGEE (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.050–1.2125 V	35 W	Socket P	April 2009	AW80576GH0836MG	$530
Core 2 Duo T9900	SLGKH (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.050–1.2125 V	35 W	FCBGA6	April 2009	AV80576GH0836MG	$530

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450),^[9][10][11] Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Select Apple subsets of P7000 series processors support Intel VT-x.^[12]
• Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
• Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
• Package size: 35 mm × 35 mm
• Transistors: 410 million ^[13]
• Steppings: (Core microarchitecture 45nm steppings)
  • C0, E0 (Penryn)
  • M0, R0 (Penryn-3M)
  • stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
  • stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo P7350	SLB44 (C0) SLB53 (M0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	Socket P	Mid 2008	AW80576GH0413M AW80577SH0413M	OEM
Core 2 Duo P7350	SLG8E (C0) SLGE3 (R0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	FC-BGA478	Mid 2008		OEM
Core 2 Duo P7370	SLG8X (R0) SLGF9 (R0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	Socket P	January 2009	AW80577SH0413M AW80577SH0413ML	OEM
Core 2 Duo P7450	SLB45 (C0) SLGF7 (R0) SLB54 (M0) SLB56 (M0)	2	2.13 GHz	3 MB	1066 MT/s	8×	1.00–1.250 V	25 W	Socket P	January 2009	AW80577SH0463M AW80576GH0463M (C0)	OEM
Core 2 Duo P7450	SLGFF (C0)	2	2.13 GHz	3 MB	1066 MT/s	8×	1.00–1.250 V	25 W	FC-BGA478	January 2009	AW80577P7450M (C0)	OEM
Core 2 Duo P7550	SLGF8 (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	June 2009	AW80577SH0513MA	OEM
Core 2 Duo P7570	SLGLW (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	Q3 2009	AW80577SH0513ML	OEM
Core 2 Duo P8400	SLB3R (M0) SLB3Q (M0) SLB52 (M0) SLG8Z (M0) SLGCC (R0) SLGCQ (R0) SLGCF (R0) SLGFC (R0) SLGCL (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	June 13, 2008[14]	AW80577SH0513M AW80577SH0513MN BX80577P8400	$209
Core 2 Duo P8400	SLB4M (M0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	FC-BGA478	June 2008	AV80577SH0513M	$209
Core 2 Duo P8600	SLB3S (M0) SLGA4 (M0) SLGFD (R0)	2	2.4 GHz	3 MB	1066 MT/s	9×	1.00–1.250 V	25 W	Socket P	June 2008[15]	AW80577SH0563M BX80577P8600	$241
Core 2 Duo P8600	SLB4N (M0) SLGDZ (R0)	2	2.4 GHz	3 MB	1066 MT/s	9×	1.00–1.250 V	25 W	FC-BGA478	June 2008	AV80577SH0563M	$241
Core 2 Duo P8700	SLGFE (R0)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	1.00–1.250 V	25 W	Socket P	December 2008	AW80577SH0613MG BX80577P8700	$241
Core 2 Duo P8700	SLGFG (R0)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	1.00–1.250 V	25 W	FC-BGA478	December 2008	AV80577SH0613MG	$241
Core 2 Duo P8800	SLGLR (R0)	2	2.67 GHz	3 MB	1066 MT/s	10×	1.00–1.250 V	25 W	Socket P	Q2 2009	AW80577SH0673MG BX80577P8800	$241
Core 2 Duo P8800	SLGLA (E0)	2	2.67 GHz	3 MB	1066 MT/s	10×	1.00–1.250 V	25 W	FC-BGA478	Q2 2009	AV80577SH0673MG	$241
Core 2 Duo P9500	SLB4E (C0) SLGE8 (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.05–1.162 V	25 W	Socket P	July 2008	AW80576SH0616M AV80576SH0616M	$348
Core 2 Duo P9600	SLGE6 (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.05–1.212 V	25 W	Socket P	December 2008	AW80576SH0676MG	$348
Core 2 Duo P9700	SLGQS (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.012–1.175 V	28 W	Socket P	June 2009	AW80576SH0726MG	$348

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SP9300	SLB63 (C0)	2	2.27 GHz	6 MB	1066 MT/s	8.5×	0.900–1.225 V	25 W	μFC-BGA 956	July 2008	AV80576SH0516M	$284
Core 2 Duo SP9400	SLB64 (C0) SLGHG (C0) SLGAA (E0)	2	2.4 GHz	6 MB	1066 MT/s	9×	0.900–1.225 V	25 W	μFC-BGA 956	July 2008	AV80576SH0566M	$284
Core 2 Duo SP9600	SLGER (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	0.900–1.225 V	25 W	μFC-BGA 956	Q1 2009	AV80576SH0516M AV80576SH0616M	$316

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SL9300	SLB65 (C0) SLGHC (C0) SLGAG (E0)	2	1.6 GHz	6 MB	1066 MT/s	6×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LH0256M	$284
Core 2 Duo SL9380	SLGA2 (C0) SLGAD (E0)	2	1.8 GHz	6 MB	800 MT/s	9×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LG0336M	$316
Core 2 Duo SL9400	SLB66 (C0) SLGHD (C0) SLGAB (E0)	2	1.87 GHz	6 MB	1066 MT/s	7×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LH0366M	$316
Core 2 Duo SL9600	SLGEQ (E0)	2	2.13 GHz	6 MB	1066 MT/s	8×	1.050–1.150 V	17 W	μFC-BGA 956	Q1'09	AV80576LH0466M	$316

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: M0, R0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SU7300	SLGS6 (R0) SLGYV (R0)	2	1.3 GHz	3 MB	800 MT/s	6.5×	1.05–1.15 V	10 W	μFC-BGA 956	September 2009	AV80577UG0133M AV80577UG0133ML	$289
Core 2 Duo SU9300	SLB5Q (M0) SLGAL (R0)	2	1.2 GHz	3 MB	800 MT/s	6×	1.05–1.15 V	10 W	μFC-BGA 956	September 2008	AV80577UG0093M	$262
Core 2 Duo SU9400	SLB5V (M0) SLGHN (M0) SLGAK (R0)	2	1.4 GHz	3 MB	800 MT/s	7×	1.05–1.15 V	10 W	μFC-BGA 956	September 2008	AV80577UG0173M	$289
Core 2 Duo SU9600	SLGEX (R0) SLGFN (R0)	2	1.6 GHz	3 MB	800 MT/s	8×	1.05–1.15 V	10 W	μFC-BGA 956	Q1 2009	AV80577UG0253M	$289

• These models feature an unlocked clock multiplier
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
• Die size: 107 mm²
• Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme X9000	SLAQJ (C0) SLAZ3 (C0)	2	2.8 GHz	6 MB	800 MT/s	14×	1.062–1.150 V	44 W	Socket P	January 2008	FF80576ZG0726M	$851
Core 2 Extreme X9100	SLB48 (C0) SLG8M (C0) SLGE7 (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.062–1.150 V	44 W	Socket P	July 2008	AW80576GH0836M	$851

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
• Die size: 2 × 107 mm²
• Steppings: E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Quad Q9000	SLGEJ (E0)	4	2 GHz	2 × 3 MB	1066 MT/s	7.5×	1.050–1.175 V	45 W	Socket P	December 2008	AW80581GH0416M BX80581Q9000	$348
Core 2 Quad Q9100	SLB5G (E0)	4	2.27 GHz	2 × 6 MB	1066 MT/s	8.5×	1.050–1.175 V	45 W	Socket P	August 2008	AW80581GH051003	$851

• This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
• Package size: 35 mm × 35 mm
• Die size: 2 × 107 mm²
• Steppings: E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Extreme QX9300	SLB5J (E0)	4	2.53 GHz	2 × 6 MiB	1066 MT/s	9.5×	1.050–1.175 V	45 W	Socket P	August 2008	AW80581ZH061003	$1038

Common features:

• Socket: G1.
• All the CPUs support dual-channel DDR3-1333 RAM.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• XM-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date
			Base	Turbo
Core i7	940XM	4 (8)	2.13	3.33	8 MB	55 W	June 2010
	920XM		2.00	3.20			September 2009
	840QM		1.86			45 W	June 2010
	820QM		1.73	3.06			September 2009
	740QM			2.93	6 MB		June 2010
	720QM		1.60	2.80			September 2009

Common features:

• Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
• All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	680UM	2 (4)	1.46	2.53	HD Graphics	166–500	4 MB	18 W	September 2010
	660LM		2.26	3.06		266–566		25 W
	660UM		1.33	2.40		166–500		18 W	May 2010
	640M		2.80	3.46		500–766		35 W	September 2010
	640LM		2.13	2.93		266–566		25 W	January 2010
	640UM		1.20	2.27		166–500		18 W
	620M		2.66	3.33		500–766		35 W
	620LM		2.00	2.80		266–566		25 W
	620UM		1.06	2.13		166–500		18 W
Core i5	580M		2.66	3.33		500–766	3 MB	35 W	September 2010
	560M			3.20
	560UM		1.33	2.13		166–500		18 W
	540M		2.53	3.07		500–766		35 W	January 2010
	540UM		1.20	2.00		166–500		18 W	May 2010
	520M		2.40	2.93		500–766		35 W	January 2010
	520UM		1.07	1.87		166–500		18 W
	480M		2.66	2.93		500–766		35 W	January 2011
	470UM		1.33	1.86		166–500		18 W	October 2010
	460M		2.53	2.80		500–766		35 W	September 2010
	450M		2.40	2.66					June 2010
	430M		2.26	2.53					January 2010
	430UM		1.20	1.73		166–500		18 W	May 2010
Core i3	390M		2.66	—N/a		500–667		35 W	January 2011
	380M		2.53						September 2010
	380UM		1.33			166–500		18 W	October 2010
	370M		2.40			500–667		35 W	June 2010
	350M		2.26						January 2010
	330M		2.13
	330UM		1.20			166–500		18 W	May 2010

Common features:

• Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
• All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• XM-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	2960XM	4 (8)	2.7	3.7	HD 3000	650–1300	8 MB	55 W	September 2011
	2920XM		2.5	3.5					January 2011
	2860QM			3.6				45 W	September 2011
	2820QM		2.3	3.4					January 2011
	2760QM		2.4	3.5			6 MB		September 2011
	2720QM		2.2	3.3					January 2011
	2675QM			3.1		650–1200			October 2011
	2670QM					650–1100
	2635QM		2.0	2.9		650–1200			January 2011
	2630QM					650–1100
	2677M	2 (4)	1.8	2.9		350–1200	4 MB	17 W	June 2011
	2657M		1.6	2.7		350–1000			February 2011
	2640M		2.8	3.5		650–1300		35 W	September 2011
	2649M		2.3	3.2		500–1100		25 W	February 2011
	2637M		1.7	2.8		350–1200		17 W	June 2011
	2620M		2.7	3.4		650–1300		35 W	February 2011
	2629M		2.1	3.0		500–1100		25 W
	2617M		1.5	2.6		350–950		17 W
Core i5	2557M		1.7	2.7		350–1200	3 MB		June 2011
	2540M		2.6	3.3		650–1300		35 W	February 2011
	2537M		1.4	2.3		350–900		17 W
	2520M		2.5	3.2		650–1300		35 W
	2467M		1.6	2.3		350–1150		17 W	June 2011
	2450M		2.5	3.1		650–1300		35 W	January 2012
	2435M		2.4	3.0					September 2011
	2430M					650–1200			October 2011
	2415M		2.3	2.9		650–1300			Q1 2011
	2410M					650–1200			February 2011
Core i3	2370M		2.4	—N/a		650–1150			January 2012
	2377M		1.5			350–1000		17 W	September 2012
	2375M								Q1 2013
	2367M		1.4						October 2011
	2365M								September 2012
	2350M		2.3			650–1150		35 W	October 2011
	2357M		1.3			350–950		17 W	June 2011
	2348M		2.3			650–1150		35 W	January 2013
	2332M[16]		2.2			650–1100			September 2011
	2330M								June 2011
	2328M								September 2012
	2312M		2.1						Q2 2011
	2310M								February 2011
	2308M[17]								Q3 2012

Common features:

• Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
• All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• XM-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	3940XM	4 (8)	3.0	3.9	HD 4000	650–1350	8 MB	55 W	September 2012
	3920XM		2.9	3.8		650–1300			April 2012
	3840QM		2.8					45 W	September 2012
	3820QM		2.7	3.7		650–1250			April 2012
	3740QM					650–1300	6 MB		September 2012
	3720QM		2.6	3.6		650–1250			April 2012
	3635QM		2.4	3.4		650–1200			September 2012
	3630QM					650–1150
	3632QM		2.2	3.2				35 W	October 2012
	3615QM		2.3	3.3		650–1200		45 W	April 2012
	3610QM					650–1100
	3612QM		2.1	3.1				35 W
	3687U	2 (4)	2.1	3.3		350–1200	4 MB	17 W	January 2013
	3689Y		1.5	2.6		350–850		13 W
	3667U		2.0	3.2		350–1150		17 W	June 2012
	3540M		3.0	3.7		650–1300		35 W	January 2013
	3537U		2.0	3.1		350–1200		17 W
	3520M		2.9	3.6		650–1250		35 W	June 2012
	3517U		1.9	3.0		350–1150		17 W
Core i5	3437U			2.9		650–1200	3 MB		January 2013
	3439Y		1.5	2.3		350–850		13 W
	3427U		1.8	2.8		350–1150		17 W	June 2012
	3380M		2.9	3.6		650–1250		35 W	January 2013
	3360M		2.8	3.5		650–1200			June 2012
	3340M		2.7	3.4		650–1250			January 2013
	3337U		1.8	2.7		350–1100		17 W
	3339Y		1.5	2.0		350–850		13 W
	3320M		2.6	3.3		650–1200		35 W	June 2012
	3317U		1.7	2.6		350–1050		17 W
	3230M		2.6	3.2		650–1100		35 W	January 2013
	3210M		2.5	3.1					June 2012
Core i3	3227U		1.9	—N/a		350–1100		17 W	January 2013
	3229Y		1.4			350–850		13 W
	3217U		1.8			350–1050		17 W	June 2012
	3130M		2.6			650–1100		35 W	January 2013
	3120M		2.5						September 2012
	3110M		2.4			650–1000			June 2012

Common features:

• Socket: G3.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• MX-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4940MX	4 (8)	3.1	4.0	HD 4600	400–1350	8 MB	57 W	February 2014
	4930MX		3.0	3.9					June 2013
	4910MQ		2.9			400–1300		47 W	February 2014
	4900MQ		2.8	3.8					June 2013
	4810MQ						6 MB		February 2014
	4800MQ		2.7	3.7					June 2013
	4710MQ		2.5	3.5		400–1150			April 2014
	4712MQ		2.3	3.3				37 W
	4700MQ		2.4	3.4				47 W	June 2013
	4702MQ		2.2	3.2				37 W
	4610M	2 (4)	3.0	3.7		400–1300	4 MB		February 2014
	4600M		2.9	3.6					September 2013
Core i5	4340M					400–1250	3 MB		February 2014
	4330M		2.8	3.5					September 2013
	4310M		2.7	3.4					February 2014
	4300M		2.6	3.3					September 2013
	4210M			3.2		400–1150			April 2014
	4200M		2.5	3.1					September 2013
Core i3	4110M		2.6	—N/a		400–1100			April 2014
	4100M		2.5						September 2013
	4010M[18]								Q3 2014
	4000M		2.4						September 2013

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4650U	2 (4)	1.7	3.3	HD 5000	200–1100	4 MB	15 W	June 2013
	4600U		2.1		HD 4400				September 2013
	4578U		3.0	3.5	Iris 5100	200–1200		28 W	July 2014
	4558U		2.8	3.3					June 2013
	4550U		1.5	3.0	HD 5000	200–1100		15 W
	4510U		2.0	3.1	HD 4400				April 2014
	4500U		1.8	3.0					June 2013
Core i5	4360U		1.5		HD 5000		3 MB		February 2014
	4350U		1.4	2.9					June 2013
	4310U		2.0	3.0	HD 4400				February 2014
	4308U		2.8	3.3	Iris 5100	200–1200		28 W	July 2014
	4300U		1.9	2.9	HD 4400	200–1100		15 W	September 2013
	4288U		2.6	3.1	Iris 5100	200–1200		28 W	June 2013
	4278U					200–1100			July 2014
	4260U		1.4	2.7	HD 5000	200–1000		15 W	April 2014
	4258U		2.4	2.9	Iris 5100	200–1100		28 W	June 2013
	4250U		1.3	2.6	HD 5000	200–1000		15 W
	4210U		1.7	2.7	HD 4400				April 2014
	4200U		1.6	2.6					June 2013
Core i3	4158U		2.0	—N/a	Iris 5100	200–1100		28 W
	4120U				HD 4400	200–1000		15 W	April 2014
	4100U		1.8						June 2013
	4030U		1.9						April 2014
	4025U					200–950
	4010U		1.7			200–1000			June 2013
	4005U					200–950			September 2013

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4610Y	2 (4)	1.7	2.9	HD 4200	200–850	4 MB	11.5 W	September 2013
Core i5	4302Y		1.6	2.3			3 MB
	4300Y
	4220Y			2.0					April 2014
	4210Y		1.5	1.9					September 2013
	4202Y		1.6	2.0
	4200Y		1.4	1.9					June 2013
Core i3	4030Y		1.6	—N/a					April 2014
	4020Y		1.5						September 2013
	4012Y
	4010Y		1.3						June 2013

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 22 nm.
• i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4980HQ	4 (8)	2.8	4.0	Iris Pro 5200	200–1300	6 MB	47 W	July 2014
	4960HQ		2.6	3.8					September 2013
	4950HQ		2.4	3.6					June 2013
	4870HQ		2.5	3.7		200–1200			July 2014
	4860HQ		2.4	3.6					February 2014
	4850HQ		2.3	3.5					June 2013
	4770HQ		2.2	3.4					July 2014
	4760HQ		2.1	3.3					April 2014
	4750HQ		2.0	3.2					June 2013
	4720HQ		2.6	3.6	HD 4600	400–1200			January 2015
	4722HQ		2.4	3.4		400–1150		37 W
	4710HQ		2.5	3.5		400–1200		47 W	April 2014
	4712HQ		2.3	3.3		400–1150		37 W
	4700HQ		2.4	3.4		400–1200		47 W	June 2013
	4702HQ		2.2	3.2		400–1150		37 W
Core i5	4210H	2 (4)	2.9	3.5			3 MB	47 W	July 2014
	4200H		2.8	3.4					September 2013

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5650U	2 (4)	2.2	3.2	HD 6000	300–1000	4 MB	15 W	January 2015
	5600U		2.6		HD 5500	300–950
	5557U		3.1	3.4	Iris 6100	300–1100		28 W
	5550U		2.0	3.0	HD 6000	300–1000		15 W
	5500U		2.4		HD 5500	300–950
Core i5	5350U		1.8	2.9	HD 6000	300–1000	3 MB
	5300U		2.3		HD 5500	300–900
	5287U		2.9	3.3	Iris 6100	300–1100		28 W
	5257U		2.7	3.1		300–1050
	5250U		1.6	2.7	HD 6000	300–1000		15 W
	5200U		2.2		HD 5500	300–900
Core i3	5157U		2.5	—N/a	Iris 6100	300–1000		28 W
	5020U		2.2		HD 5500	300–900		15 W	March 2015
	5015U		2.1			300–850
	5010U					300–900			January 2015
	5005U		2.0			300–850

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5950HQ	4 (8)	2.9	3.7	Iris Pro 6200	300–1150	6 MB	47 W	June 2015
	5850HQ		2.7	3.6		300–1100
	5750HQ		2.5	3.4		300–1050
	5700HQ		2.7	3.5	HD 5600
Core i5	5350H	2 (4)	3.1		Iris Pro 6200		4 MB

Common features:

• Socket: BGA 1234.
• All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core M	5Y71	2 (4)	1.2	2.9	HD 5300	300–900	4 MB	4.5 W	October 2014
	5Y70		1.1	2.6		100–850			September 2014
	5Y51					300–900			October 2014
	5Y31		0.9	2.4		300–850
	5Y10c		0.8	2.0		300–800
	5Y10a					100–800			September 2014
	5Y10

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6660U	2 (4)	2.4	3.4	Iris 540	300–1050	4 MB	15 W	March 2016
	6650U		2.2						September 2015
	6600U		2.6		HD 520
	6567U		3.3	3.6	Iris 550	300–1100		28 W
	6560U		2.2	3.2	Iris 540	300–1050		15 W
	6500U		2.5	3.1	HD 520
	6498DU				HD 510				December 2015
Core i5	6360U		2.0		Iris 540	300–1000	3 MB		September 2015
	6300U		2.4	3.0	HD 520
	6287U		3.1	3.5	Iris 550	300–1100	4 MB	28 W
	6267U		2.9	3.3		300–1050
	6260U		1.8	2.9	Iris 540	300–950		15 W
	6200U		2.3	2.8	HD 520	300–1000	3 MB
	6198DU				HD 510				December 2015
Core i3	6167U		2.7	—N/a	Iris 550			28 W
	6157U		2.4						September 2016
	6100U		2.3		HD 520			15 W	September 2015
	6006U		2.0			300–900			November 2016

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6970HQ	4 (8)	2.8	3.7	Iris Pro 580	350–1050	8 MB	45 W	January 2016
	6920HQ		2.9	3.8	HD 530				September 2015
	6870HQ		2.7	3.6	Iris Pro 580	350–1000			January 2016
	6820HQ				HD 530	350–1050			September 2015
	6820HK
	6770HQ		2.6	3.5	Iris Pro 580	350–950	6 MB		January 2016
	6700HQ				HD 530	350–1050			September 2015
Core i5	6440HQ	4 (4)				350–950
	6350HQ		2.3	3.2	Iris Pro 580	350–900			February 2016
	6300HQ				HD 530	350–950			September 2015
Core i3	6100H	2 (4)	2.7	—N/a		350–900	3 MB	35 W

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m7	6Y75	2 (4)	1.2	3.1	HD 515	300–1000	4 MB	4.5 W	September 2015
Core m5	6Y57		1.1	2.8		300–900
	6Y54			2.7
Core m3	6Y30		0.9	2.2		300–850

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7660U	2 (4)	2.5	4.0	Iris Plus 640	300–1100	4 MB	15 W	January 2017
	7600U		2.8	3.9	HD 620	300–1150
	7567U		3.5	4.0	Iris Plus 650			28 W
	7560U		2.4	3.8	Iris Plus 640	300–1050		15 W
	7500U		2.7	3.5	HD 620				September 2016
Core i5	7360U		2.3	3.6	Iris Plus 640	300–1000			January 2017
	7300U		2.6	3.5	HD 620	300–1100	3 MB
	7287U		3.3	3.7	Iris Plus 650		4 MB	28 W
	7267U		3.1	3.5		300–1050
	7260U		2.2	3.4	Iris Plus 640	300–950		15 W
	7200U		2.5	3.1	HD 620	300–1000	3 MB		September 2016
Core i3	7167U		2.8	—N/a	Iris Plus 650			28 W	January 2017
	7130U		2.7		HD 620			15 W	June 2017
	7100U		2.4						September 2016
	7020U		2.3						Q2 2018

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7920HQ	4 (8)	3.1	4.1	HD 630	350–1100	8 MB	45 W	January 2017
	7820HK		2.9	3.9
	7820HQ
	7700HQ		2.8	3.8			6 MB
Core i5	7440HQ	4 (4)				300–1000
	7300HQ		2.5	3.5
Core i3	7100H	2 (4)	3.0	—N/a		300–950	3 MB	35 W

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7Y75	2 (4)	1.3	3.6	HD 615	300–1050	4 MB	4.5 W	September 2016
Core i5	7Y57		1.2	3.3		300–950			January 2017
	7Y54			3.2					September 2016

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m3	7Y32	2 (4)	1.1	3.0	HD 615	300–900	4 MB	4.5 W	April 2017
	7Y30		1.0	2.6					September 2016

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8569U	4 (8)	2.8	4.7	Iris Plus 655	300–1200	8 MB	28 W	May 2019
	8559U		2.7	4.5					April 2018
	8557U		1.7		Iris Plus 645	300–1150		15 W	July 2019
Core i5	8279U		2.4	4.1	Iris Plus 655		6 MB	28 W	May 2019
	8269U		2.6	4.2		300–1100			April 2018
	8260U		1.6	3.9	UHD 620			15 W	Q4 2019
	8259U		2.3	3.8	Iris Plus 655	300–1050		28 W	April 2018
	8257U		1.4	3.9	Iris Plus 645			15 W	July 2019
Core i3	8140U	2 (4)	2.1		UHD 620	300–1000	4 MB	15 W	Q4 2019
	8109U		3.0	3.6	Iris Plus 655	300–1050		28 W	April 2018

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	8950HK	6 (12)	2.9	4.8	UHD 630	350–1200	12 MB	45 W	April 2018
Core i7	8850H		2.6	4.3		350–1150	9 MB
	8750H		2.2	4.1		350–1100
Core i5	8400H	4 (8)	2.5	4.2			8 MB
	8300H		2.3	4.0		350–1000
Core i3	8100H	4 (4)	3.0	—N/a			6 MB		July 2018

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8700B	6 (12)	3.2	4.6	UHD 630	350–1200	12 MB	65 W	April 2018
Core i5	8500B	6 (6)	3.0	4.1		350–1100	9 MB
	8400B		2.8	4.0		350–1050
Core i3	8100B	4 (4)	3.6	—N/a			6 MB		Q3 2018

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8650U	4 (8)	1.9	4.2	UHD 620	300–1150	8 MB	15 W	August 2017
	8550U		1.8	4.0
Core i5	8350U		1.7	3.6		300–1100	6 MB
	8250U		1.6	3.4
Core i3	8130U	2 (4)	2.2			300–1000	4 MB		February 2018

Common features:

• Socket: BGA 2270.
• All the CPUs support dual-channel DDR4-2400 RAM.
• All CPU models provide 8 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Embedded dGPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)	Model	Clock (MHz)
Core i7	8809G	4 (8)	3.1	4.2	HD 630	350–1100	RX Vega M GH	1063–1190	8 MB	100 W	February 2018
	8709G			4.1
	8706G						RX Vega M GL	931–1011		65 W
	8705G
Core i5	8305G		2.8	3.2		350–1000			6 MB

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8500Y	2 (4)	1.5	4.2	UHD 615	300–1050	4 MB	5 W	August 2018
Core i5	8310Y		1.6	3.9	UHD 617			7 W	Q1 2019
	8210Y			3.6					October 2018
	8200Y		1.3	3.9	UHD 615	300–950		5 W	August 2018

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8665U	4 (8)	1.9	4.8	UHD 620	300–1150	8 MB	15 W	April 2019
	8565U		1.8	4.6					August 2018
Core i5	8365U		1.6	4.1		300–1100	6 MB		April 2019
	8265U			3.9					August 2018
Core i3	8145U	2 (4)	2.1			300–1000	4 MB

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i3	8121U	2 (4)	2.2	3.2	—N/a		4 MB	15 W	May 2018

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m3	8100Y	2 (4)	1.1	3.4	UHD 615	300–900	4 MB	5 W	August 2018

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	9980HK	8 (16)	2.4	5.0	UHD 630	350–1250	16 MB	45 W	April 2019
	9880H		2.3	4.8		350–1200
Core i7	9850H	6 (12)	2.6	4.6		350–1150	12 MB
	9750H			4.5
	9750HF				—N/a
Core i5	9400H	4 (8)	2.5	4.3	UHD 630	350–1100	8 MB
	9300H		2.4	4.1		350–1050
	9300HF				—N/a

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	10810U	6 (12)	1.1	4.7	UHD 620	300–1150	12 MB	15 W	May 2020
	10710U								August 2019
	10610U	4 (8)	1.8	4.9			8 MB		May 2020
	10510U								August 2019
Core i5	10310U		1.7	4.4			6 MB		May 2020
	10210U		1.6	4.2		300–1100			August 2019
Core i3	10110U	2 (4)	2.1	4.1		300–1000	4 MB

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	TVB	Model	Clock (MHz)
Core i9	10980HK	8 (16)	2.4	5.1	5.3	UHD 630	350–1250	16 MB	45 W	April 2020
	10885H									May 2020
Core i7	10875H		2.3	4.9	5.1		350–1200			April 2020
	10870H		2.2	4.8	5.0					September 2020
	10850H	6 (12)	2.7	4.9	5.1		350–1150	12 MB		April 2020
	10750H		2.6	4.8	5.0
Core i5	10500H		2.5	4.5	—N/a		350–1050			December 2020
	10400H	4 (8)	2.6	4.6			350–1100	8 MB		April 2020
	10300H		2.5	4.5			350–1050
	10200H		2.4	4.1						August 2020

Common features:

• Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
• PCIe 3.0 support.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1068NG7	4 (8)	2.3	4.1	Iris Plus (G7)	300–1100	8 MB	28 W	May 2020
	1068G7[19]								August 2019
	1065G7		1.3	3.9				15 W
Core i5	1038NG7		2.0	3.8		300–1050	6 MB	28 W	May 2020
	1035G7		1.2	3.7				15 W	August 2019
	1035G4		1.1		Iris Plus (G4)
	1035G1		1.0	3.6	UHD Graphics (G1)
Core i3	1005G1	2 (4)	1.2	3.4		300–900	4 MB

Common features:

• Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
• All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
• PCIe 3.0 support.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1060G7	4 (8)	1.0	3.8	Iris Plus (G7)	300–1100	8 MB	9 W	Q3 2019
Core i5	1030NG7		1.1	3.5		300–1050	6 MB	10 W	Q2 2020
	1030G7		0.8					9 W	Q3 2019
	1030G4		0.7		Iris Plus (G4)
Core i3	1000NG4	2 (4)	1.1	3.2		300–900	4 MB		Q2 2020
	1000G4								Q3 2019
	1000G1				UHD Graphics (G1)

Common features:

• Socket: BGA 1377, except for i3-10100Y which uses BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	10510Y	4 (8)	1.2	4.5	UHD 620	300–1150	8 MB	7 W	August 2019
Core i5	10310Y		1.1	4.1		300–1050	6 MB
	10210Y		1.0	4.0
Core i3	10110Y	2 (4)				300–1000	4 MB
	10100Y		1.3	3.9	UHD 615			5 W	January 2021

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1195G7	4 (8)	1.3–2.9	5.0	Iris Xe (96 EU)	?–1400	12 MB	12–28 W	June 2021
	1185G7		1.2–3.0	4.8		?–1350			September 2020
	1165G7		1.2–2.8	4.7		?–1300
Core i5	1155G7		1.0–2.5	4.5	Iris Xe (80 EU)	?–1350	8 MB		June 2021
	1145G7		1.1–2.6	4.4		?–1300			January 2021
	1135G7		0.9–2.4	4.2					September 2020
Core i3	1125G4		0.9–2.0	3.7	UHD Graphics (48 EU)	?–1250			Q1 2021
	1115G4	2 (4)	1.7–3.0	4.1			6 MB		September 2020

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel LPDDR4X-4266 RAM.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1180G7	4 (8)	0.9–2.2	4.6	Iris Xe (96 EU)	?–1100	12 MB	7–15 W	January 2021
	1160G7		0.9–2.1	4.4					September 2020
Core i5	1140G7		0.8–1.8	4.2	Iris Xe (80 EU)		8 MB		January 2021
	1130G7			4.0					September 2020
Core i3	1120G4		0.8–1.5	3.5	UHD Graphics (48 EU)				Q1 2021
	1110G4	2 (4)	1.8	3.9			6 MB		September 2020

Common features:

• Socket: BGA 1787.
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	11980HK	8 (16)	2.6–3.3	5.0	UHD Graphics (32 EU)	350–1450	24 MB	45–65 W	May 2021
	11950H		2.1–2.6					35–45 W
	11900H		2.1–2.5	4.9
Core i7	11850H			4.8
	11800H		1.9–2.3	4.6
	11600H	6 (12)	2.5–2.9				18 MB		July 2021
Core i5	11500H		2.4–2.9				12 MB		May 2021
	11400H		2.2–2.7	4.5	UHD Graphics (16 EU)
	11260H		2.1–2.6	4.4		350–1400

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
• PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	11390H	4 (8)	2.9–3.4	5.0	Iris Xe (96 EU)	?–1400	12 MB	28–35 W	June 2021
	11375H		3.0–3.3			?–1350			January 2021
	11370H			4.8
Core i5	11320H		2.5–3.2	4.5			8 MB		June 2021
	11300H		2.6–3.1	4.4	Iris Xe (80 EU)	?–1300			January 2021

Common features:

• Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
• All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
• ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.^[20]

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1265U	2 (4)	1.8	4.8	8 (8)	1.3	3.6	Iris Xe (96 EU)	?–1250	12 MB	15 W	55 W	February 2022
	1260U		1.6	4.7		0.8	3.5		?–950		9 W	29 W
	1255U		1.7			1.2			?–1250		15 W	55 W
	1250U		1.1			0.8			?–950		9 W	29 W
Core i5	1245U		1.6	4.4		1.2	3.3	Iris Xe (80 EU)	?–1200		15 W	55 W
	1240U		1.1			0.8			?–900		9 W	29 W
	1235U		1.3			0.9			?–1200		15 W	55 W
	1230U		1.0			0.7			?–850		9 W	29 W
Core i3	1215U		1.2		4 (4)	0.9		UHD Graphics (64 EU)	?–1100	10 MB	15 W	55 W
	1210U		1.0			0.7			?–850		9 W	29 W

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The following models are available with IPU (image processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1280P	6 (12)	1.8	4.8	8 (8)	1.3	3.6	Iris Xe (96 EU)	?–1450	24 MB	28 W	64 W	February 2022
	1270P	4 (8)	2.2			1.6	3.5		?–1400	18 MB
	1260P		2.1	4.7		1.5	3.4
Core i5	1250P		1.7	4.4		1.2	3.3	Iris Xe (80 EU)		12 MB
	1240P								?–1300
Core i3	1220P	2 (4)	1.5			1.1		UHD Graphics (64 EU)	?–1100

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	12900HK	6 (12)	2.5	5.0	8 (8)	1.8	3.8	Iris Xe (96 EU)	?–1450	24 MB	45 W	115 W	January 2022
	12900H
Core i7	12800H		2.4	4.8			3.7		?–1400
	12700H		2.3	4.7		1.7	3.5
	12650H				4 (4)			UHD Graphics (64 EU)
Core i5	12600H	4 (8)	2.7	4.5	8 (8)	2.0	3.3	Iris Xe (80 EU)		18 MB		95 W
	12500H		2.5			1.8			?–1300
	12450H		2.0	4.4	4 (4)	1.5		UHD Graphics (48 EU)	?–1200	12 MB

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The i9 models have unlocked multipliers, allowing them to be overclocked.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	12950HX	8 (16)	2.3	5.0	8 (8)	1.7	3.6	UHD Graphics (32 EU)	?–1550	30 MB	55 W	157 W	May 2022
	12900HX
Core i7	12850HX		2.1	4.8		1.5	3.4		?–1450	25 MB
	12800HX		2.0
	12650HX	6 (12)		4.7			3.3			24 MB
Core i5	12600HX	4 (8)	2.5	4.6		1.8			?–1350	18 MB
	12450HX		2.4	4.4	4 (4)		3.1	UHD Graphics (16 EU)	?–1300	12 MB

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

• Socket: BGA 1264.
• All the CPUs support single-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
• All CPU models provide 9 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache: 2 MB per cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP		Release date
			Base	Turbo	Model	Clock (MHz)		Base	Max. Turbo
Core i3	N305	8 (8)	1.8	3.8	UHD Graphics (32 EU)	?–1250	6 MB	15 W	35 W	January 2023
	N300		0.8					7 W	25 W

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The i3-1315U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1365U	2 (4)	1.8	5.2	8 (8)	1.3	3.9	Iris Xe (96 EU)	?–1300	12 MB	15 W	55 W	January 2023
	1355U		1.7	5.0		1.2	3.7
Core i5	1345U		1.6	4.7			3.5	Iris Xe (80 EU)	?–1250
	1335U		1.3	4.6		0.9	3.4
	1334U
Core i3	1315U		1.2	4.5	4 (4)		3.3	UHD Graphics (64 EU)		10 MB
	1305U	1 (2)	1.6			1.2

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (32 KB data + 64 KB instructions) per core.
• L2 cache:
  • P-cores: (up to) 2 MB per core.
  • E-cores: (up to) 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1370P	6 (12)	1.9	5.2	8 (8)	1.4	3.9	Iris Xe (96 EU)	?–1500	24 MB	28 W	64 W	January 2023
	1360P	4 (8)	2.2	5.0		1.6	3.7			18 MB
Core i5	1350P		1.9	4.7		1.4	3.5	Iris Xe (80 EU)		12 MB
	1340P			4.6			3.4		?–1450

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
• The i5-13500H is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13900HK	6 (12)	2.6	5.4	8 (8)	1.9	4.1	Iris Xe (96 EU)	?–1500	24 MB	45 W	115 W	January 2023
	13900H
Core i7	13800H		2.5	5.2		1.8	4.0
	13700H		2.4	5.0			3.7
	13620H			4.9	4 (4)		3.6	UHD Graphics (64 EU)
Core i5	13600H	4 (8)	2.8	4.8	8 (8)	2.1		Iris Xe (80 EU)		18 MB		95 W
	13500H		2.6	4.7		1.9	3.5		?–1450
	13420H		2.1	4.6	4 (4)	1.5	3.4	UHD Graphics (48 EU)	?–1400	12 MB

Common features:

• Socket: BGA 1792.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13905H	6 (12)	2.6	5.4	8 (8)	1.9	4.1	Iris Xe (96 EU)	?–1500	24 MB	45 W	115 W	January 2023
Core i7	13705H		2.4	5.0		1.8	3.7
Core i5	13505H	4 (8)	2.6	4.7		1.9	3.5	Iris Xe (80 EU)	?–1450	18 MB

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13645HX, i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• All models support CPU, iGPU, and memory overclocking.^[21]
• i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13980HX	8 (16)	2.2	5.6	16 (16)	1.6	4.0	UHD Graphics (32 EU)	?–1650	36 MB	55 W	157 W	January 2023
	13950HX			5.5
	13900HX			5.4			3.9
Core i7	13850HX		2.1	5.1	12 (12)	1.5	3.8		?–1600	30 MB
	13700HX			5.0	8 (8)		3.6		?–1550
	13650HX	6 (12)	2.6	4.9		1.9		UHD Graphics (16 EU)		24 MB
	13645HX						3.5	UHD Graphics (32 EU)					March 2026
Core i5	13600HX			4.7			3.6		?–1500				January 2023
	13500HX		2.5	4.6		1.8	3.5
	13450HX		2.4		4 (4)		3.4	UHD Graphics (16 EU)	?–1450	20 MB

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• All models support CPU, iGPU, and memory overclocking.
• i7-14650HX, i7-14700HX, and i9-14900HX feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
• i7-14700HX, and i9-14900HX feature Intel Application Optimization.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	14900HX	8 (16)	2.2	5.8	16 (16)	1.6	4.1	UHD Graphics (32 EU)	?–1650	36 MB	55 W	157 W	January 2024
Core i7	14700HX		2.1	5.5	12 (12)	1.5	3.9		?–1600	33 MB
	14650HX		2.2	5.2	8 (8)	1.6	3.7	UHD Graphics (16 EU)		30 MB
Core i5	14500HX	6 (12)	2.6	4.9		1.9	3.5	UHD Graphics (32 EU)	?–1550	24 MB
	14450HX		2.4	4.8	4 (4)	1.8		UHD Graphics (16 EU)	?–1500	20 MB

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Xe-LP architecture.
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The Core 3 100U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core 7	150U	2 (4)	1.8	5.4	8 (8)	1.2	4.0	Intel Graphics (96 EU)	?–1300	12 MB	15 W	55 W	January 2024
Core 5	120U		1.4	5.0		0.9	3.8	Intel Graphics (80 EU)	?–1250
Core 3	100U		1.2	4.7	4 (4)		3.3	Intel Graphics (64 EU)		10 MB

Common features:

• Socket: BGA 2049.
• All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 7	165U	2 (4)	1.7	4.9	8 (8)	1.2	3.8	Intel Graphics (4 Xe-cores)	?–2000	12 MB	15 W	57 W	December 2023
	164U		1.1	4.8		0.7			?–1800		9 W	30 W
	155U		1.7			1.2			?–1950		15 W	57 W
Core Ultra 5	135U		1.6	4.4		1.1	3.6		?–1900
	134U		0.7			0.5			?–1750		9 W	30 W
	125U		1.3	4.3		0.8			?–1850		15 W	57 W
	115U		1.5	4.2	4 (4)	1.0	3.5	Intel Graphics (3 Xe-cores)	?–1800	10 MB

Common features:

• Socket: BGA 2049.
• All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 9	185H	6 (12)	2.3	5.1	8 (8)	1.8	3.8	Intel Arc (8 Xe-cores)	?–2350	24 MB	45 W	115 W	December 2023
Core Ultra 7	165H		1.4	5.0		0.9			?–2300		28 W
	155H			4.8					?–2250
Core Ultra 5	135H	4 (8)	1.7	4.6		1.2	3.6		?–2200	18 MB
	125H		1.2	4.5		0.7		Intel Arc (7 Xe-cores)

Common features:

• Socket: BGA 1744.
• All CPUs support dual-channel DDR4-3200, LPDDR4X-4266, DDR5-5200, and LPDDR5(X)-6400 RAM.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core 7	250U	2 (4)	1.8	5.4	8 (8)	1.2	4.0	Intel Graphics (96 EU)	?–1300	12 MB	15 W	55 W	January 2025
Core 5	220U		1.4	5.0		0.9	3.8	Intel Graphics (80 EU)

Common features:

• Socket: BGA 2049.
• All CPUs support DDR5-6400 and LPDDR5X-8400 RAM.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 7	265U	2 (4)	2.1	5.3	8 (8)	1.7	4.2	Intel Graphics (4 Xe-cores)	?–2100	12 MB	15 W	57 W	January 2025
	255U		2.0	5.2
Core Ultra 5	235U			4.9		1.6	4.1		?–2050
	225U		1.5	4.8		1.3	3.8		?–2000

Common features:

• Socket: BGA 2833.
• All the CPUs support dual-channel LPDDR5X-8533 RAM (on package).
• All CPU models provide 4 lanes of PCIe 5.0.
• L1 cache:
  • P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
  • E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
• L2 cache:
  • P-cores: 2.5 MB (10-Way) per core.
  • E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	NPU		Integrated memory		TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Neural computes engines	NPU AI TOPS	Memory speed	Memory capacity	Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 9	288V	4 (4)	3.3	5.1	4 (4)	3.3	3.7	Intel Arc 140V (8 Xe-cores)	?–2050	12 MB	6x Gen4	48	LPDDR5X 8533 MT/s	32 GB	30 W (Min:17 W)	37 W	September 2024
Core Ultra 7	268V		2.2	5.0		2.2			?–2000						17 W (Min:8 W)
	266V													16 GB
	258V			4.8					?–1950			47		32 GB
	256V													16 GB
Core Ultra 5	238V		2.1	4.7		2.1	3.5	Intel Arc 130V (7 Xe-cores)	?–1850	8 MB	5x Gen4	40		32 GB
	236V													16 GB
	228V			4.5										32 GB
	226V													16 GB

Common features:

• Socket: BGA 1744.
• All CPUs support DDR4-3200, LPDDR4X-4266, DDR5-5200, or LPDDR5(X)-5200 RAM.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core 9	270H	6 (12)	2.7	5.8	8 (8)	2.0	4.1	Iris Xe (96 EU)	?–1550	24 MB	45 W	115 W	December 2024
Core 7	250H		2.5	5.4		1.8	4.0
	240H			5.2	4 (4)			UHD Graphics (64 EU)
	230H							—N/a					June 2026
Core 5	220H	4 (8)	2.7	4.9	8 (8)	2.0	3.7	Iris Xe (80 EU)	?–1500	18 MB			December 2024
	210H		2.2	4.8	4 (4)	1.6	3.6	UHD Graphics (48 EU)	?–1400	12 MB
	205H							—N/a					June 2026

Common features:

• Socket: BGA 2049.
• All CPUs support dual-channel DDR5-6400 and LPDDR5(X)-8400 RAM.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	NPU (TOPS)	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)			Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 9	285H	6 (6)	2.9	5.4	8 (8)	2.7	4.5	Intel Arc 140T (8 Xe-cores)	?–2350	24 MB	13	45 W	115 W	January 2025
Core Ultra 7	265H		2.2	5.3		1.7			?–2300			28 W
	255H		2.0	5.1		1.5	4.4		?–2250
Core Ultra 5	235H	4 (4)	2.4	5.0		1.8				18 MB
	225H		1.7	4.9		1.3	4.3	Intel Arc 130T (7 Xe-cores)	?–2200

Common features:

• Socket: BGA 2114.
• All CPUs support dual-channel DDR5-6400 RAM and Core Ultra 290HX Plus, 270HX Plus also support DDR5-7200 RAM.
  • Core Ultra 245HX, 265HX, and 285HX support ECC memory.
• Core Ultra 9 285HX supports Intel vPro and related technologies.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	NPU (TOPS)	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)			Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 9	290HX Plus	8 (8)	2.7	5.5	16 (16)	1.8	4.7	Intel Arc (4 Xe-cores)	300–2000	36 MB	13	55 W	160 W	March 2026
	285HX		2.8			2.1	4.6							January 2025
	275HX		2.7	5.4					300–1900
Core Ultra 7	270HX Plus		2.4	5.3	12(12)	1.8	4.7			30 MB				March 2026
	265HX		2.6			2.3	4.6							January 2025
	255HX		2.4	5.2		1.8	4.5		300–1850
Core Ultra 5	245HX	6 (6)	3.1	5.1	8 (8)	2.6		Intel Arc (3 Xe-cores)	300–1900	24 MB
	235HX		2.9

Common features:

• Socket: BGA 1264.
• All CPUs support dual-channel DDR4-3200 or single-channel DDR5 or LPDDR5-4800 RAM.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP		Release date
			Base	Turbo	Model	Clock (MHz)		Base	Max. Turbo
Core 3	N355	8 (8)	1.8	3.9	UHD Graphics (32 EU)	?–1350	6 MB	15 W	35 W	January 2025
	N350		0.8					7 W	25 W

Common features:

• Socket: BGA 2540.
• All CPUs support dual-channel memory.
• Fabrication process:
  • 8 Core + 4 Xe GPU: Compute Tile (Contains the CPU cores) Intel's 18A process node, GPU tile "Intel 3" process node.
  • 16 Core + 4 Xe GPU: Compute Tile (Contains the CPU cores) Intel's 18A process node, GPU tile "Intel 3" process node.
  • 16 Core + 12 Xe GPU: Compute Tile (Contains the CPU cores) Intel's 18A process node, GPU tile TSMC's N3E process node.

Processor branding	Model	P-core (performance)			E-core (efficiency)			LPE-core (efficiency)			Integrated GPU		Smart Cache	NPU AI TOPS	Memory		TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)			Max. speed	Max. capacity	Base	Max. Turbo
			Base	Turbo		Base	Turbo		Base	Turbo
Core Ultra X9	388H	4 (4)	2.1	5.1	8 (8)	1.6	4.0	4 (4)	1.6	3.7	Intel Arc B390 (12 Xe-cores)	?–2500	18 MB	50	LPDDR5X 9600 MT/s	96 GB	25 W (Min:15 W)	80 W	January 2026
Core Ultra 9	386H			4.9			3.9			3.5	Intel Graphics (4 Xe-cores)				LPDDR5X-8533 MT/s DDR5-7200 MT/s	96 GB 128 GB
Core Ultra X9	378H		2.0	5.0			3.8			3.6	Intel Arc B390 (12 Xe-cores)				LPDDR5X 9600 MT/s	96 GB			April 2026
Core Ultra X7	368H						4.0												January 2026
Core Ultra 7	366H			4.8			3.8			3.4	Intel Graphics (4 Xe-cores)				LPDDR5X-8533 MT/s DDR5-7200 MT/s	96 GB 128 GB
	365		2.4		—N/a				1.8	3.6			12 MB	49	LPDDR5X-7467 MT/s DDR5-6400 MT/s	96 GB 128 GB	25 W (Min:12 W)	55 W
Core Ultra X7	358H		1.9		8 (8)	1.5	3.7		1.5	3.3	Intel Arc B390 (12 Xe-cores)		18 MB	50	LPDDR5X-9600 MT/s	96 GB	25 W (Min:15 W)	80 W
Core Ultra 7	356H			4.7							Intel Graphics (4 Xe-cores)	?–2450			LPDDR5X-8533 MT/s DDR5-7200 MT/s	96 GB 128 GB
	355		2.3		—N/a				1.7	3.5		?–2500	12 MB	49	LPDDR5X-7467 MT/s DDR5-6400 MT/s	96 GB 128 GB	25 W (Min:12 W)	55 W
Core Ultra 5	338H		1.9		4 (4)	1.5	3.6		1.5	3.3	Intel Arc B370 (10 Xe-cores)	?–2400	18 MB	47	LPDDR5X-8533 MT/s	96 GB	25 W (Min:15 W)	80 W
	336H			4.6						3.2	Intel Graphics (4 Xe-cores)	?–2300			LPDDR5X-8533 MT/s DDR5-7200 MT/s	96 GB 128 GB
	335		2.2		—N/a				1.6	3.4		?–2450	12 MB		LPDDR5X-7467 MT/s DDR5-6400 MT/s	96 GB 128 GB	25 W (Min:12 W)	55 W
	325		2.1	4.5								?–2300
	332	2 (2)	2.5	4.4					1.9	3.3	Intel Graphics (2 Xe-cores)	?–2450		46
	322											?–2300

Common features:

• All CPUs support single-channel DDR5-6400(max. 64 GB) and LPDDR5(X)-7467(max. 48 GB) RAM.
• Fabrication process: Intel's 18A process node.

Processor branding	Model	P-core (performance)			LPE-core (efficiency)			Integrated GPU		Smart Cache	NPU (TOPS)	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)			Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core 7	360	2 (2)	1.5	4.8	4 (4)	1.4	3.6	Intel Graphics (2 Xe-cores)	?–2600	6 MB	17	15 W	35 W	April 2026
	350
Core 5	330			4.6			3.4		?–2500		16
	320
	315			4.4			3.3		?-2300		15
Core 3	304	1(1)		4.3				Intel Graphics (1 Xe-core)

• List of Intel Core desktop processors
• List of Intel Pentium M microprocessors
• List of Intel Celeron processors
• List of Intel Pentium processors
• Intel Core
• Intel Core 2
• Comparison of Intel processors
• Enhanced Pentium M (microarchitecture)
• Intel Core (microarchitecture)
• Penryn (microarchitecture)
• Alder Lake (microprocessor)

• ATI provides pointer to Intel's 'Allendale', May 23, 2006
• Rumoured prices and specifications for Intel Core 2, May 30, 2006
• TGDaily indicates leaked release dates,^{[permanent dead link]} July 24, 2006
• Intel to unveil five Merom CPUs in July, paper says(subscription required) as re-reported by DigiTimes, July 17, 2006
• Intel Unveils World's Best Processor,^{[dead link]} July 27, 2006
• Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip,^{[dead link]} July 16, 2007
• CORE 2 DUO 1333 MHZ STEPPING Archived May 20, 2022, at the Wayback Machine, July 18, 2007

• Search MDDS Database
• Intel ARK Database
• SSPEC/QDF Reference (Intel)
• Intel® Processor Names, Numbers and Generation List
• Intel CPU Transition Roadmap 2008–2013
• Intel Desktop CPU Roadmap 2004–2011
• Intel Core Solo mobile processor product order code table
• Intel Core Duo mobile processor product order code table
• Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet
• Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update
• Intel Core 2 Duo Processors Technical Documents
• Intel Core i3 desktop processor product order code table
• Intel Core i3 mobile processor product order code table
• Intel Core i5 desktop processor product order code table
• Intel Core i5 mobile processor product order code table
• Intel Core i7 desktop processor product order code table
• Intel Core i7 mobile processor product order code table
• Intel Core i7 desktop processor Extreme Edition product order code table
• Intel Core i7 mobile processor Extreme Edition product order code table
• Intel's Core i7 web page
• Intel's Core i7 Extreme Edition web page
• Intel's Core i7 Processor Numbers
• Intel's Core i7 Extreme Edition Processor Numbers
• Intel Corporation – Processor Price List
• Intel Corporation – Processor Price List
• Intel Core X-series processors