The designation uses the Cyrillic alphabet which sometimes leads to confusion where a Cyrillic letter has the same appearance as a Latin letter but is romanized as a different letter. Furthermore, for some Cyrillic letters the Romanization is ambiguous.
History
The nomenclature for integrated circuits has changed somewhat over the years as new standards were published:
Throughout this article the standards are referred to by the year they came into force. Before 1968 each manufacturer used its own integrated circuit designation.[1][15] Following the dissolution of the Soviet Union in 1991, the standards were not as strictly enforced, and a number of manufacturers introduced manufacturer-specific designations again. These were typically used in parallel with the standards. However, integrated circuits for military, aerospace, and nuclear applications in Russia still have to follow the standard designation. Underlining this, the 2010 standard is explicitly labelled a Russian military standard. Beside Russia the 2010 standard is applied in Belarus as well. Companies in Ukraine mostly stayed with the 1980 standard and prefixed the designation with the letter У (U), e.g. УМ5701ВЕ51.[16] The 1980 standard was published in Ukraine as DSTU 3212—95 (Ukrainian: ДСТУ 3212-95). Bulgarian designations for bipolar integrated circuits, e.g. 1УО709С,[17] look confusingly similar to the 1968 Soviet designations but the standards differ. The functional group is also indicated by two letters in the Cyrillic alphabet and many groups were obviously copied from the Soviet standard (АГ, ИД, ИЕ, ЛБ, ЛН, ЛП, МП, ПК, СА, УС). Some subgroups differ (ТД, УМ, УО) and some groups are completely different (НС, ОИ, РН). For the number after the functional group there is no concept of a series. Instead, that number usually matches the Western counterpart (e.g. the 1УО709С is equivalent to a μA709).
Also as a consequence of the dissolution of the Soviet Union, COCOM restrictions were lifted and Russian integrated circuit design firms gained access to foundries abroad. In that sense it could be argued that the importance of the Soviet designation has spread across the globe. When foundries are not able to label the circuit in the Cyrillic alphabet then the Latin alphabet is used (e.g. KF1174PP1[18]). The sanctions in response to the Russian invasion of Ukraine ended this international co-operation in 2022.
In general, devices already in production when a new standard came out kept their old designation. However, in some case devices were renamed:
When the 1980 standard was published, devices named after the 1968 standard and still in production were renamed, e.g. К1ЛБ553 to К155ЛА3.[1][19] As in this example, the renaming was often fairly straightforward: The two parts of the serial number were combined (1 and 55 to 155), the functional group remained unchanged or was converted as in the table below (ЛБ to ЛА), and the variant number remained unchanged (3). In some series the renaming was more complicated.[20] This change affected many series (e.g. 101, 116, 118, 122, 133, 140, 153, 155, 174, 237, 501).
Before the introduction of a package designation in 1980 the suffix П (P) was used in some series to indicate a plastic package (as opposed to the then more-common ceramic package). In 1983 the package designation was changed for the 531 series (e.g. К531ЛА19П to КР531ЛА19).[6]: 59–60 Other series were similarly renamed at some point (e.g. К501ХЛ1П to КР501ХЛ1).
Before the definition of group В (V) in 1980 computing devices were all assigned subgroup ИК (IK), e.g. microprocessors (КР580ИК80А), peripheral devices (КР580ИК51А). With the introduction of group В the devices in the 580 series were renamed (to КР580ВМ80А and КР580ВВ51А, respectively) in 1986.
Since the publication of the 2000 standard, some devices have been labeled with the package designation according to the new standard, e.g. КР1407УД2 to К1407УД2Р and КФ1407УД2 to К1407УД2Т.[21]
Starting in 2016, certain newer devices were renamed according to the 2010 standard, e.g. 1967ВЦ2Ф to 1967ВН028[22] and 1586ПВ1АУ to 1583НВ025 (note the change of the series).[23]
Structure of the designation
1968
1973 / 1980
2000
2010
Elements:
1 – Prefix (zero to three letters)
1a – Export designation: The letter Э (E) here indicates an integrated circuit intended for export with a pin spacing of 2.54mm (1/10") or 1.27mm (1/20"). If this element is empty then the device has the Soviet (metric) spacing of 2.5mm or 1.25mm between pins.
1b – Application area: The letter К (K) here indicates an integrated circuit for commercial and consumer applications (with requirements according to GOST 18725—83). If this element is empty then the device is intended for harsher environments (e.g. extended temperature range) which is also referred to as military acceptance (ВП).
1c – Package designation (1980) (Note that the letters Э and К are not valid package designations. If this element is empty then the package is simply not specified in the designation, i.e. it could be any of the packages.)
2c – Number of the series (2 digits): The numbers of the series are assigned sequentially and have no further meaning. Devices in a series have some characteristic in common although it varies from one series to another which characteristic that is (e.g. logic family for logic gates, instruction set for microprocessors).
2d – Number of the series (2 or 3 digits): The 2000 / 2010 standards do not assign a special meaning to the second digit of a 4-digit series.
3b – Subgroup within the group: All groups have the subgroup П (P) for "others", that is for devices that fall into the group but not into any of the other defined subgroups.
3c – Functional Group (2010): The functional groups for the 2010 standard are in a separate table since the change from 2000 to 2010 is far more drastic than any of the previous changes.
4 – Variant within the functional subgroup (one to four digits): Usually the variant numbers are assigned sequentially for devices within the subgroup (e.g. ЛА1, ЛА2, ЛА3, etc.). In some series the variant number matches the last two or three digits of the designation of its Western counterpart (e.g. К500ЛК117 and MC10117).
4a – For the 2010 standard, the variant is always 2 digits in length, with a leading zero if necessary. When there is no version letter then the variant appears to be 3 digits in length (e.g. 1906ВМ016) but the third digit is actually the package designation (element 5e).
5 – Suffix
5a – Version (one letter, А to Я except З and Й): This optional element indicates versions of an integrated circuit with different electrical or thermal characteristics (e.g. switching speed, voltage range, etc.). It can also indicate an improved version of a device (e.g. К580ИК80 vs. К580ИК80А). Before 1980 the suffix П (P) was sometimes used to indicate a version in a plastic package instead of a ceramic package (e.g. К145ИК2П, К531ЛА19П) or a round metal can (e.g. К144ИР1П).
5b – Version (one letter, А to М except З and Й): This element is omitted if there is only one version of a device.
5c – Package designation (2000) (one letter, Н to Я): If this element is empty then the package is simply not specified in the designation, i.e. it could be any of the packages. Note that the letter ranges for version and package designation do not overlap.
5f – Package variant (one letter; А, В, С, Е, Н, К, М, Р, Т, or Х): If variants of an integrated circuit have the same parameters and package designation but differ in pinout or number of pins, then this package variant letter is added (e.g. 5400ТР045 and 5400ТР045А). Some vendors assign version letters outside the allowed range (e.g. 1395ЕН10Ж5Б).
5g – Version (one letter; А, В, С, Е, К, М, Р, Т, or Х): This element is omitted if there is only one version of a device. Note that for the 2010 standard a different package is indicated by element 5f instead. Some vendors assign version letters outside the allowed range (e.g. 1494УА02Б3).
^ abcIn 1973 group Ш was moved to Б and then in 2000 to Э. Unfortunately, this makes some transcriptions ambiguous since both Е and Э are transcribed as E.
^ abcSubgroup ХН was moved to БА in 2000 and then to ТМ in 2010.[14]
^ abcSubgroup ХТ was moved to БК in 2000 and then to ТР in 2010.[14]
^ abcSubgroup ХМ was moved to БЦ in 2000 and then to ТН in 2010.[14]
^ abBefore the definition of group В (V) in 1980 computing devices were all assigned subgroup ИК (IK), e.g. microprocessors (КР580ИК80А), peripheral devices (КР580ИК51А). With the introduction of group В the devices in the 580 series were renamed (to КР580ВМ80А and КР580ВВ51А, respectively) in 1986.
^ abcInitially digital signal processors (DSP) were assigned subgroup ВМ (VM, e.g. 1867ВМ2). In 2000 the new subgroup ВЦ (VTs) was added (e.g. 1867ВЦ2АТ). In 2010 DSP were moved to subgroup ВН (VN).[22]
^ abcAnalog multi-functional devices were moved in 1973 from subgroup ЖА to ХА and then in 2010 to ТА.[14]
^ abcdeIn 1973 the subgroups ЖВ, ЖЕ, and ЖК were combined into subgroup ХК. In 2010 digital multi-functional devices were moved to subgroup ТК.[14]
^ abcdeIn 1973 the subgroups ЖГ, ЖИ, and ЖЛ were combined into subgroup ХЛ. In 2010 digital multi-functional devices were moved to subgroup ТВ.[14]
^ abcBefore the introduction of subgroup ИА in 1980, many ALU devices had already been assigned subgroups ИК (e.g. КР531ИК2) or ИП (e.g. К155ИП3, 564ИП3, КР1530ИП14).
^ abIn 1973 encoders were moved from subgroup ИШ to subgroup ИВ.
^ abIn 1973 full adders were moved from subgroup ИС to subgroup ИМ.
^ abThe distinction between voltage switches (КН) and current switches (КТ) is somewhat unclear. There are analogue switches and multiplexers in both subgroups.
^ abcWith the introduction of subgroups ЛА and ЛЕ in 1973 most devices from subgroup ЛБ were re-labelled (e.g. К1ЛБ553 to К155ЛА3). It appears that subgroup ЛБ was kept in the standard for devices from subgroup ЛБ that fit neither in ЛА nor in ЛЕ (e.g. 134ЛБ2 with 2 NAND gates and 1 NOT gate).
^ abIn 1973 expander circuits were moved from subgroup ЛП to subgroup ЛД.
^ abAll known ECL devices in subgroup ЛК are listed as OR-AND-NOT instead of AND-OR-NOT.[6]: 90 [24] The equivalent Motorola devices (e.g. Motorola MC10117 for К500ЛК117) are also listed as OR-AND-NOT. Similarly, ECL devices in subgroup ЛС are listed as OR-AND instead of AND-OR (e.g. К500ЛС118, equivalent to Motorola MC10118).
^ abIn 1973 the catch-all subgroup ЛЭ was moved to ЛП.
^ abIn 1973 resistor arrays were moved from subgroup НС to subgroup НР.
^ abcIn 1973 D/A converters were moved from subgroup ПД to subgroup ПА and then in 2010 to НА.[23]
^ abcIn 1973 A/D converters were moved from subgroup ПК to subgroup ПВ and then in 2010 to НВ.[23]
^For the 1980 standard subgroup ПК is listed in [6][8][9] but not in.[7][10]
^ abcIn 1974, subgroup ЯМ was split into РВ and РМ.
^ abcInitially FIFO and multi-port devices were included in subgroup РП. In 2000 they were assigned the separate subgroups РГ and РК, respectively.
^ abIn 2000 subgroup РУ was split into РУ and РД, with РУ from then on limited to SRAM.
^ abcdeIn 1980 subgroup РЕ was split into РЕ, РР, РТ, and РФ, with РЕ from then on limited to mask ROM. In [5]: 19 РР and РТ are listed for the 1973 standard. This is somewhat implausible, as early PROMs were placed in subgroup РЕ (e.g. К555РЕ4[6]: 59 or К500РЕ149[6]: 91 ).
^ abInitially subgroup РР was used for all EEPROM and Flash devices, regardless of the interface. In 2000 subgroup РС was introduced for devices with a serial interface and subgroup РР was limited to devices with a parallel interface.
^ abIn 1980 amplitude comparators were moved from subgroup СА to subgroup СК.
^For the 1980 standard subgroup СФ is listed in [10] but not in.[6][7][8][9]
^ abIn 1973 Schmitt triggers were moved from subgroup ТШ to subgroup ТЛ.
^ abIn 1973 T flip-flops were moved from subgroup ТС to subgroup ТТ.
^ abcUntil 1973 both differential and operational amplifiers were included in subgroup УТ. In 1980 differential amplifiers were moved out of subgroup УД into their own subgroup УС.
^ abIn 1973 unity gain buffers were moved from subgroup УЭ to subgroup УЕ.
^ abcIn 1973 band-pass filters were moved from subgroup ФП to subgroup ФЕ, and then in 2000 to subgroup ФБ.
^ abFor 1968 [2] lists ФГ for band-stop filters while [3] lists ФС. In 1973 band-stop filters were moved to subgroup ФР.
^Group ХИ is somewhat dubious. For the 1980 standard it is listed in [10][7] while [6][8] give ХН instead for arrays of analogue cells.
The package of an integrated circuit was generally not indicated in the 1973 designation, except:
Bare chips without a package received a series number in the 7xx range, e.g. K712RV2-1 (К712РВ2-1).
The suffix П (P) was sometimes used to indicate a version in a plastic package instead of a ceramic package (e.g. К145ИК2П, К531ЛА19П) or a round metal can (e.g. К144ИР1П).
Less common than П, the suffix М (M) was sometimes used to indicate a ceramic package and Т (T) for a metal-ceramic package (e.g. К500ТМ133М and К500ТМ133Т, respectively, instead of К500ТМ133 in a plastic package).[9]
For bare chips without a package an additional digit indicates the constructive variant.[6]: 16 [9][10][11] For the 1973 and 1980 standards the variant digit is appended with a dash after the designation (e.g. К712РВ2-1 and Б533ТМ2-2, respectively). For the 2000 and 2010 standards the variant digit follows immediately after the package designation N (e.g. 5862ПФ1Н4 and 1374МХ01Н1, respectively).
Constructive variant
Description
1
with flexible wires (flying wire)
2
on polyamide carrier tape (film bonding technology)
on a wafer, cut without loss of orientation (e.g. pasted on a carrier)
6
with bonding pads without wires
Manufacturer designation
A manufacturer designation was introduced only with the 2000 standard.[12] As part of the type designation the manufacturer is required only for a second-source integrated circuit that was "developed and produced according to an independently developed design and technological documentation, and corresponding to the technical requirements of the originally developed original microcircuit".[12]: 9 Manufacturer logos[26][27] are more common.
Although not strictly part of the designation, a number of markings are often found on integrated circuit packages:[78][14]
Marking
Description
Russian
English
ОП
OP
Engineering or pre-production sample
ОС
OS
Military acceptance, higher quality and reliability
ОСД
OSD
Military acceptance, higher quality and reliability, extended lifetime
ОСМ
OSM
Military acceptance, highest quality and reliability, available in only in small quantities
С
S
Military acceptance, used in the 1970s instead of ОС
Military acceptance here means that the integrated circuit can be used in applications where its failure would be catastrophic and where repair or exchange is difficult or impossible (e.g. aerospace applications).
For mask-programmed devices (e.g. gate arrays, mask-programmed single-chip microcontrollers, mask ROMs) a three- or four-digit mask number follows the type designation (e.g. К1801ВП1-014).
A date code is usually printed on the package. In the early 1970s the date code consisted of a Roman numeral for the month and a two-digit year (e.g. IX 72). Later the month was given as one or two digits (e.g. 5-73 or 0386). In the late 1980s most plants switched to a 4-digit code with a 2-digit year followed by a 2-digit month (e.g. 8909) or a 2-digit week (e.g. 9051). Overall, the date code format was not strictly enforced. Several series of integrated circuits (e.g. 1408, 1821) bore an IEC 60062 letter and digit code (e.g. A1 for January 1990).
Romanization
The Romanization of Russian is standardized, but there are at least 12 standards to choose from. Fortunately, the Soviet integrated circuit designation uses a subset of the Cyrillic alphabet where only a few letters are ambiguous:
Ж: Ž, Zh
Х: X, H, Ch, Kh
Ц: C, Cz, Ts, Tc
Ч: Č, Ch
The more-common romanizations in bold are given as alternatives in the above tables.
Е and Э are both romanized as E.
The French romanization of Russian and the German romanization of Russian differ in some letters from the one used in English. For instance, the Russian КР580ВМ80A becomes KR580VM80A in English and French but KR580WM80A in German literature.
^ abc"102ая и 116ая серии" [Series 102 and 116] (in Russian). Музей электронных раритетов. Retrieved 11 May 2016.
^ abc"Условные обозначения микросхем" [Integrated circuit designations]. Радио (in Russian). March 1977. pp. 57–58. Retrieved 19 November 2017. Translated in "Bezeichnungskode für sowjetische IS" [Designation code for Soviet ICs] (PDF). Radio Fernsehen Elektronik (in German). 29 (7): 446. 1980. Retrieved 20 November 2017.
^Schubert, Karl-Heinz (1 February 1974). "Elektronisches Jahrbuch für den Funkamateur 1975" [Electronics Yearbook for the Radio Amateur 1975] (in German). Berlin: Militärverlag der DDR: 117–126. ISSN0424-8678. OCLC74220762. {{cite journal}}: Cite journal requires |journal= (help)
^ abcdefghijkНиссельсон, Л.И. (1989). Цифровые и аналоговые интегральные микросхемы [Digital and analog integrated circuits] (in Russian). Радио и связь. ISBN5256002597.
^ ab"Новое обозначение микросхем серии 1967" [New designation for integrated circuits of the 1967 series] (in Russian). PKK Milandr. 15 February 2016. Archived from the original on 6 September 2021. Retrieved 22 September 2022.
^"КАТАЛОГ ИЗДЕЛИЙ" [Product catalog] (PDF) (in Russian). Bolkhov: OAO "BZPP". 2017. Archived from the original(PDF) on 28 March 2018. Retrieved 1 December 2017.
^"Интегральные микросхемы" [Integrated circuits] (in Russian). Minsk: OAO "Integral". Retrieved 24 May 2016.
^"Каталог" [Catalog] (in Russian). Bryansk: ZAO "NTTs SIT". Retrieved 27 June 2016.
^"Микросхемы" [Integrated circuits] (in Russian). Kaluga: AO "Voshod". Archived from the original on 24 August 2021. Retrieved 8 June 2016.
^"ПРОДУКЦИЯ" [Products] (in Russian). Novosibirsk: AO "NPP Vostok". Archived from the original on 6 May 2020. Retrieved 19 March 2021.
^"Интегральные микросхемы" [Integrated circuits]. niiet.ru (in Russian). Voronezh: OAO "NIIET". Retrieved 27 April 2020.
^"Интегральные микросхемы" [Integrated circuits] (in Russian). Minsk: "Transistor" branch of OAO "Integral". Archived from the original on 2 March 2019. Retrieved 7 April 2016.
^"КАТАЛОГ ИЗДЕЛИЙ" [Product catalog] (in Russian). Bryansk: ZAO Kremny Marketing. Archived from the original on 4 September 2017. Retrieved 8 March 2018.
^"КАТАЛОГ ИЗДЕЛИЙ" [Product catalog] (PDF) (in Russian). Bryansk: AO Group Kremny EL. Retrieved 25 May 2022.
^"Продукция" [Products] (in Russian). Kaluga: ZAO "OKB MEL". Retrieved 12 June 2016.
^"Микросхемы ПАО Микрон 2020" [Integrated Circuits PAO Mikron 2020] (PDF) (in Russian). Mikron. Retrieved 16 February 2021.
^"Каталог" [Catalog] (in Russian). Moscow: AO "Optron". Retrieved 4 March 2019.
^"ПРОДУКЦИЯ" [Products] (in Russian). Novosibirsk: AO NZPP. Retrieved 31 May 2016.
^"Продукция" [Products] (in Russian). Nalchik: OAO "NZPP-KBR" (former "Elkor"). Archived from the original on 16 September 2018. Retrieved 27 April 2020.
^"Каталог продукции" [Product catalog] (in Russian). Tomsk: AO "NIIPP". Retrieved 31 May 2016.
^"ИНТЕГРАЛЬНЫЕ МИКРОСХЕМЫ" [Integrated circuits] (in Russian). Moscow: OAO NPP "Pulsar". Retrieved 30 September 2022.
^"Каталог товаров" [Product catalog] (in Russian). Riga: RD Alfa. Retrieved 6 May 2016.
^"Каталог продукции" [Product catalog] (in Russian). Saint Petersburg: ZAO Svetlana Semiconductors. Retrieved 30 May 2016.
^"Каталог изделий 2021" [Product catalog 2021] (PDF) (in Russian). Voronezh: OAO "VZPP-S". Retrieved 30 September 2022.
^"Интегральные микросхемы" [Integrated circuits] (in Russian). Moscow: OAO "Exiton". Archived from the original on 17 March 2022. Retrieved 30 September 2022.
^"Микроэлектроника" [Microelectronics] (in Russian). NTC Module. Retrieved 20 April 2020.
^"Микропроцессоры и СБИС" [Microprocessors and VLSI] (in Russian). Moscow: MCST. Retrieved 3 October 2022.
^"Микросхемы" [Integrated circuits] (in Russian). Zelenograd: Elvees Multicore. Retrieved 3 October 2022.
^"Продукция" [Products] (in Russian). Moscow: OAO NPO "Fizika". Retrieved 13 May 2016.
^"Продукция" [Products] (in Russian). Moscow: PAO NPP "Sapfir". Retrieved 31 May 2016.
^"Микросхемы" [Integrated circuits] (in Russian). Moscow: NPK "TTs". Retrieved 1 September 2016.
^"БИС и СБИС" [LSI and VLSI] (in Russian). Moscow: AO NIIMA "Progress". Retrieved 13 September 2016.
^"Микросхемы" [Integrated circuits] (in Russian). Tomilino: OAO NPP "Eltom". Archived from the original on 1 May 2017. Retrieved 28 March 2018.
^"ПРАЙС-ЛИСТ" [Price list] (PDF) (in Russian). Alexandrov: OOO Krip Tekhno. 2018. Retrieved 27 October 2019.
^"Продукция" [Products] (in Russian). Minsk: OOO "NTTs DELS". Retrieved 28 June 2016.
^"ПРОДУКЦИЯ И ЦЕНЫ" [Products and prices] (in Russian). Kiev: DP "Kvazar-IS". Retrieved 7 April 2016.
^"Каталог товаров" [Product catalog] (in Russian). Ivano-Frankivsk: TOV TD "Elektronni komponenti" (former "Rodon" and "Logika"). Retrieved 15 June 2016.
^"Продукция предприятия" [The company's products] (in Russian). Kherson: DP "Dnepr Semiconductors". Archived from the original on 5 June 2017. Retrieved 28 March 2018.
^"Каталог продукции" [Product catalog] (in Russian). Tashkent: OAO "Foton". Archived from the original on 13 March 2019. Retrieved 26 March 2021.