IEEE Transactions on Advanced Packaging

Discipline	Multi-chip modules, wafer-scale integration
Language	English
Edited by	Ganesh Subbarayan
Publication details
Former name(s)	IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing
History	1999–2010
Publisher	IEEE Components, Packaging, and Manufacturing Technology Society
Frequency	Quarterly
Impact factor	1.276 (2010)
Standard abbreviations ISO 4 (alt) · Bluebook (alt) NLM (alt) · MathSciNet (alt )
ISO 4	IEEE Trans. Adv. Packag.
Indexing CODEN (alt · alt2) · JSTOR (alt) · LCCN (alt) MIAR · NLM (alt) · Scopus
CODEN	ITAPFZ
ISSN	1521-3323
LCCN	99111625
OCLC no.	39742480
Links
Journal homepage

IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.^[1]

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