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Semiconductor device fabrication
MOSFET scaling (process nodes)
020 μm – 1968 010 μm – 1971 006 μm – 1974 003 μm – 1977  1.5 μm – 1981 001 μm – 1984 800 nm – 1987 600 nm – 1990 350 nm – 1993 250 nm – 1996 180 nm – 1999 130 nm – 2001 090 nm – 2003 065 nm – 2005 045 nm – 2007 032 nm – 2009 028 nm – 2010 022 nm – 2012 014 nm – 2014 010 nm – 2016 007 nm – 2018 005 nm – 2020 003 nm – 2022
Future 002 nm ~ 2025
Half-nodes Density CMOS Device (multi-gate) Moore's law Transistor count Semiconductor Industry Nanoelectronics
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The 130 nanometer (130 nm) process is a level of semiconductor process technology that was reached in the 2000–2001 timeframe by such leading semiconductor companies as Intel, Texas Instruments, IBM, and TSMC.

The origin of the 130 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS).

Some of the first CPUs manufactured with this process include Intel Tualatin family of Pentium III processors.

• Motorola PowerPC 7447 and 7457 2002
• IBM Gekko (GameCube)
• IBM PowerPC G5 970 - October 2002 - June 2003
• Intel Pentium III Tualatin - 2001-06
• Intel Celeron Tualatin-256 - 2001-10-02
• Intel Pentium M Banias - 2003-03-12
• Intel Pentium 4 Northwood - 2002-01-07
• Intel Celeron Northwood-128 - 2002-09-18
• Intel Xeon Prestonia and Gallatin - 2002-02-25
• VIA C3 - 2001
• AMD Athlon XP Thoroughbred, Thorton, and Barton
• AMD Athlon MP Thoroughbred - 2002-08-27
• AMD Athlon XP-M Thoroughbred, Barton, and Dublin
• AMD Duron Applebred - 2003-08-21
• AMD K7 Sempron Thoroughbred-B, Thorton, and Barton - 2004-07-28
• AMD K8 Sempron Paris - 2004-07-28
• AMD Athlon 64 Clawhammer and Newcastle - 2003-09-23
• AMD Opteron Sledgehammer - 2003-06-30
• Elbrus 2000 1891ВМ4Я (1891VM4YA) - 2008-04-27 ^[1]
• MCST-R500S 1891BM3 - 2008-07-27 ^[2]
• Vortex 86SX - ^[3]

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